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Department of Telecommunications and Teleinformatics

Department of Telecommunications and Teleinformatics Faculty of Automatic Control, Electronics and Computer Science

Physical-Layer Design for Future Generation Wireless Communications

Dear Sir or Madam

I would like to kindly invite you to submit research articles for the special issue of Electronics journal, which I have the pleasure to co-edit. The main topic is "Physical-Layer Design for Future Generation Wireless Communications". Details can be found in the attached call for papers, as well as at: https://www.mdpi.com/journal/electronics/special_issues/PLDWC_electronics

I have been assured that all authors invited by me will receive a 20% discount on the accepted article fee. I very much look forward to your interest and submission of articles.

Yours sincerely
Wojciech Sułek

Physical-Layer Design for Future Generation Wireless Communications (banner)

Physical-Layer Design for Future Generation Wireless Communications Electronics (an Open Access Journal by MDPI) Special Issue: Physical-Layer Design for Future Generation Wireless Communications Download
Author: MK     Published At: 15.06.2021

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