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Author: Martin Huć     Published At: 24.07.2025
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Take part in InterTechDoc’25

On September 15-17, 2025, the Faculty of Biomedical Engineering of the Silesian University of Technology in Zabrze will host the jubilee edition of InterTechDoc’25 – an inter-university scientific conference of an interdisciplinary nature, addressed to students, doctoral students, young scientists, and representatives of the industrial sector.

 The conference is a space for presenting research results, exchanging experiences, and integrating the young science environment. The main objective of the event is to support scientific development, promote inter-university cooperation and create conditions conducive to interdisciplinary scientific dialog.

 Forms of participation

Participants can apply in one of three available forms:

  • oral presentation – an individual presentation with the results of the research,
  • scientific poster – presentation in graphic form,
  • passive participation – without speaking.

 Registration

Applications for participation in the conference are accepted until September 3, 2025, only via the online form: link.

 Publications

Participants have the opportunity to submit full texts of scientific articles for publication. The deadline for submitting works is 12 September 2025. Texts should be sent by e-mail to the following address : article.sd@polsl.pl

Articles should be prepared in accordance with editorial guidelines and contain the required copyright statements. All submissions will be subject to a review process.

 Conference fee

The cost of participation in the conference is PLN 400 The fee includes participation in the event, conference materials and coffee breaks. The participants organize the accommodation on their own.

More information at website: https://portal.polsl.pl/doktoranci/ps_wydarzenia/intertechdoc-25/

 All interested are cordially invited to participate. InterTechDoc’25 is not only a scientific event – it is a space for joint development, cooperation, and knowledge exchange.

InterTechDoc'23

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